Time To Market experts
with fast production turnaround from 24h
VIP (Via In Pad)
Flat pads (for SMT assembly) with non-conductive ink and transmit thermal energy out and away from the source with conductive ink are the main advantages of via filling and copper capping process.
In order to achieve a perfect results with no plating dimples and no air bubbles in the hole during filling we use an automatic process.
We use Peters PP2795 material.