Print Electronics 
    Time To Market experts 
    with fast production turnaround from 24h
 

Special process

VIP (Via In Pad)

Flat pads (for SMT assembly) with non-conductive ink and transmit thermal energy out and away from the source with conductive ink are the main advantages of via filling and copper capping process.

In order to achieve a perfect results with no plating dimples and no air bubbles in the hole during filling we use an automatic process.

We use Peters PP2795 material. 

Sales inquiries

Email: sales@print-e.co.il

Tel: 03-9611168 ext. 109-110

WIP & delivery follow up

Email: wip@print-e.co.il

Tel: 03-9611168 ext. 201

Customer service

Email: customerservice@print-e.co.il

Tel: 03-9611168 ext. 108

 

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