Print Electronics 
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Production capabilities and Roadmap

 

Feature

2014

Roadmap

 

Standard

Advanced

 

Layer count

1 – 28L

36L

60L

Minimum dielectric thickness

0.075mm for PCB
0.025mm for FPC

≤0.05mm for PCB
0.015mm for FPC

≤0.05mm for PCB
0.012mm for FPC

HDI / Buried – blind via

Y

Y

Y

Copper filled BVH (Y/N)

Y

Y

Y

Capped via (Y/N)

Y

Y

Y

Maximum board size (mm)

1000 x 580

1200 X 610

1200 X 610

Minimum board thickness
2L

0.2 mm for rigid
0.05mm for 1L FPC
0.12mm for 2L FPC

0.15mm for rigid
0.05mm for 1L FPC
0.12mm for 2L FPC

≤0.1mm for rigid
0.05mm for 1L FPC
0.12mm for 2L FPC

Minimum board thickness
>=4L (mm)

0.40mm for PCB
0.20 for FPC

0.35mm for PCB
0.16 for FPC

≤0.30mm for PCB
0.16 for FPC

Maximum PCB thickness

7.0

10.0

10.0

Minimum track / gap IL of 0.5 Oz

0.075mm

0.05mm

0.05mm

Minimum track / gap OL of 0.5 Oz

0.075mm

0.05mm

0.05mm

Surface finish

ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Soft gold

ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Soft gold

ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Soft gold

Layer to layer registration

0.10mm

≤ 0.075mm

≤ 0.075mm

Minimum hole (mech) (mm/mil)

0.20mm

0.15mm

0.15mm

Minimum hole (laser) (mm/mil)

0.10mm

0.06mm

0.075mm

Aspect ratio PTH

10:1

13:1

15:1

Aspect ratio BVH

0.8:1

1.3:1

1.3:1

Finish hole tolerance (PTH)

± 0.10mm

± 0.05mm

± 0.05mm

Finish hole tolerance (NPTH)

± 0.05mm

≤ ± 0.05mm

≤ ± 0.05mm

Maximum Cu weight OL

3

5oz

10oz

Controlled impedance (+/- X%)

Others ± 10%

± 5%

± 5%

 

 

 

 

Rigid-flex (Y/N)

Y

Y

Y

Flexible (Y/N)

Y

Y

Y

Embedded components (Y/N)

Y

Y

Y

Sales inquiries

Email: sales@print-e.co.il

Tel: 03-9611168 ext. 109-110

WIP & delivery follow up

Email: wip@print-e.co.il

Tel: 03-9611168 ext. 201

Customer service

Email: customerservice@print-e.co.il

Tel: 03-9611168 ext. 108

 

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